Huizhou Dongcheng Laser Technology Co., LTD
Semiconductor Chip Industry
Wafer laser cutting machines can be used for wafer reshaping, drilling, and scribing, improving processing efficiency and material utilization.
Currently, a large number of chip wafers use single-crystal silicon, polycrystalline silicon, silicon carbide, and other substrate materials. Wafer laser cutting machines can be used for wafer reshaping, drilling, and scribing, improving processing efficiency and material utilization.
